| Positioning | Soldering | ||||
|---|---|---|---|---|---|
| Manual | By means of Equipment* | Manual | Vapour Phase | Vacuum Vapour Phase | |
| BGA >0,4mm pitch | |||||
| BGA ≤ 0,4mm pitch | |||||
| ICs ≥ 0,3mm pitch | |||||
| ICs < 0,3mm pitch | |||||
| SMD ≥ shape 01005 | |||||
| Press-fit components | |||||
| Wire bonding | |||||
| Cleaning of PCBA | |||||
| Assembly Rigid PCB | |||||
| Assembly Rigid Flex | |||||
| Assembly Rigid Flex-Rigid | |||||
| Assembly Stretch (Stretch-rigid) | |||||
| Thickness PCB <=3,6 mm | |||||
| Thickness PCB >3,6 mm | |||||
| Specific packages | |||||
| SOT1232 | |||||
Dimensions pcba in equipment
| in mm | with | depth | hight |
|---|---|---|---|
| UV Laser | 660 | 600 | |
| CNC drill/rout | 400 | 620 | |
| Line Iineo | 700 | 460 | |
| Line Finesse | 500 | 400 | |
| Vapour phase vacuum 230°C | 650 | 650 | |
| Netto screen | 600 | 650 | |
| Selective soldering 295°C | 600 | 500 | |
| 180 degrees turned | 700 | 500 | |
| Fluxshooter | 600 | 600 | |
| Washing | 530 | 530 | 520 |
| Washing max | 700 | 500 | |
| Stove | 1000 | 500 | 1200 |
| Vacuum stove | 500 | 400 | |
| AOI Saki 3D | 500 | 450 | |
| Measuring table | 700 | 600 | |
| SEM | 100 | 100 | 50 |
| Rontgen rotating | 500 | 400 | |
| Rontgen flat | 640 | 500 | |
| Kelvin probe testing | 700 | 600 | |
| Bonding station for Repair station BGA/LGA | 300 | 200 |