Applicable Industry Standards

PCBAs supplied by S & Q Europe B.V. are conforming to the latest version of following standards, and of standards referenced therein.

IPC-6010 Series of Performance Specification for PCBs.
IPC-A-600 Acceptability of Printed Boards.
IPC-A-610 Acceptability of Electronic Assemblies.
IPC-J-STD-003 Solderability tests for printed boards.
IPC/JEDEC-J-STD-609 Marking and labelling of components, PCBs and PCBAs to Identify Lead (Pb), Pb-free and Other Attributes.
IPC-9252 Level B Electrical test for bare boards.


All information is provided on an as is basis. Although supplier has done it utmost to have this information complete and correct, supplier cannot be held responsible for any incorrect and/or incomplete information. Supplier can never be held responsible for any damages resulting from the use of this information. Supplier has the right to alter this information at any time without notice.


The assembly shop is dedicated to do a fast turnaround of assembly projects with focus on Quality and Flexibility.

  • Small series of complex printed circuit assembly
  • Tools, training programs and experience of the team is focused on manual mounting of parts. IPC610 trained and qualified staff.
  • Automated assemblies, due to positioning requirements and/or quantities, are executed in close cooperation with partner companies.
  • Fast turnaround: 3WDS for quotations and 2-5 WDS for assembly (lead-time components and complexity of the project do impact the lead-time)

PCBA are conform IPC610, Class II, ISO9001

All bare PCBs are conforming to EC-Regulation nr. 1907/2006 – REACH.
No substances classified as “Substances of Very High Concern” (SVHC) present.
All components are conforming to EC-Regulation nr. 1907/2006 – REACH

All bare PCBs are conforming to Directive 2011/65/EU of the European Parliament and of the Council, RoHS 2 (Restriction of Hazardous Substances).
All components are, unless specific components are specified, conforming to Directive 2011/65/EU of the European Parliament and of the Council, RoHS 2

Unless explicitly specified otherwise:

  • PCBs are manufactured according IPC-6000 series.
  • PCBS are inspected according to the IPC-A-600 (class II).
  • All test methods should be according IPC-TM-652.


PCB Printed circuit board not populated
PCBA Printed circuit board populated with components
PCS Single piece printed circuit board
Panel Composition of one or more pieces (PCS) PCB of the same design
Tooling A set of data / films / masks to manufacture the PCB
Stencil To apply the solder paste on the PCB
NRE Non-recurring engineering cost (all one-time cost made to execute the project, stencil and tooling can be part of it)
CoC Certificate of Conformity
BGA Ball Grid Array
SOT Small-Outline Transistor


For all documents the latest version with the latest date is valid for production.
NOTE: In case of a conflict the customer will be contacted before starting production.

Capability Matrix

Positioning Soldering
Manual By means of Equipment* Manual Vapour Phase Vacuum Vapour Phase
BGA >0,4mm pitch
BGA ≤ 0,4mm pitch
ICs ≥ 0,3mm pitch
ICs < 0,3mm pitch
SMD ≥ shape 01005
Press-fit components
Wire bonding
Cleaning of PCBA
Assembly Rigid PCB
Assembly Rigid Flex
Assembly Rigid Flex-Rigid
Assembly Stretch (Stretch-rigid)
Thickness PCB <=3,6 mm
Thickness PCB >3,6 mm
Specific packages
*Processes executed in cooperation with partners

Dimensions pcba in equipment

in mm with depth hight
UV Laser 660 600
CNC drill/rout 400 620
Line Iineo 700 460
Line Finesse 500 400
Vapour phase vacuum 230°C 650 650
Netto screen 600 650
Selective soldering 295°C 600 500
180 degrees turned 700 500
Fluxshooter 600 600
Washing 530 530 520
Washing max 700 500
Stove 1000 500 1200
Vacuum stove 500 400
AOI Saki 3D 500 450
Measuring table 700 600
SEM 100 100 50
Rontgen rotating 500 400
Rontgen flat 640 500
Kelvin probe testing 700 600
Bonding station for Repair station BGA/LGA 300 200


The Service Centre is specially organized to cope with very different projects. Therefore, for all projects a project leader is appointed. The project leader takes care of:

  • Are the processes needed for the assembly within the capabilities?
  • Planning the project and sourcing the required components.
  • Components are only sourced from A-class distributors to secure the quality.
  • Planning the production of the PCBAs.
  • Checking that all the parts are collected in a production bin.
  • Being the main contact for the customer for all technical related issues.
  • That before delivery, the project leader checks the project if all the agreed work has been done.


7.1.Visual inspection system
7.2.3D X-Ray inspection
7.3.No functional test
7.4.Interconnection test optional

Production Tools

8.1. ESD safe work spaces + ESD test equipment
8.2. Manual soldering stations
8.3. Stereo Microscopes
8.4. Pasta dispensing / screener, maximum dimensions TBD
8.5. Pre-heater
8.6. Wire bond machine (manual/automatic)
8.7. Iineo plus pick & placer
8.8. Vapour phase soldering from Rehm and Ascon, maximum dimensions: 650 x 650mm
8.9. Fluxshooter from Interflux
8.10. Selective soldering from Ersa
8.11. PCBA Cleaning machine
8.12. Cleanroom and many flow cabinets with 0 particles >= 0.05 um


Lead free and suitable for lead free soldering materials and components are used unless specified otherwise.


CoC, Certificate of Conformity containing minimal the following:
  • Part number
  • Quantity
  • Reference to PO
  • Statement of Conformity
  • (CoC can be ordered at no additional cost at the moment of product ordering)


11.1. The PCBs are electrically tested, according IPC-9252 Level B.
11.2. Components from A class distributors are used.
11.3. All PCBAs are visually inspected for correct components, correct placing of components and quality of the soldering joints.
11.4. As the product is not functionally tested, complaints on malfunction of the PCB are not accepted which are outside the scope of activities of S & Q Europe Model-shop.

Packaging of products

  • Packaging box single or double wall corrugated boxes.
  • Maximum weight of an individual box is 15 kg.
  • The circuit boards are fixed in such a way that the boards cannot slide over each other or can be damaged during transport.
  • PCBA will be packed in an ESD protective bag, including label.
  • Each shipping container will be provided with a label with the following information:
    • Purchase order number.
    • Item number.
    • Date code (if required).
    • Quantity of PCBAs.
  • In case of multiple boxes in one shipment, one box will carry the paperwork at the outside of the box and/or be clearly marked by means of sticker or coloured tape.


Phone: +31(0)492 598484


Jeroen Charmant:

John Geenen:

Maurice Keulers:

PCB technical capabilities

Production standards (tolerances) According to standards: IPC-A-600 Class 2
(The standard is available on request)
Number of PCB layers 1-12 layers
Layer build-up according to requirements - Selection
Minimum track and gap size Minimum track width / isolation gap: 0.1 mm
Drilling Minimum drill diameter: 0.2 mm (PTH 0.15 mm)
Aspect ratio: 1:12
Soldermask Colors: green, blue, red, white, black
Silk screen Colors: green, blue, red, white, black
Surface treatment lead-free HAL
chemical NiAu
Mechanical finish milling
Testing methods electrical test
optical test- AOI
controlled impedance
micro sections
Further options Manufacturing Standard IPC-A-600 Class3

UL certification UL-file number:E258735

Controlled impedance according IPC-2141A
Total PCB thickness up to 6 mm

Edge plating
plated half-hole

carbon layer
removable paint
Via-hole filler

Z-axis milling
Interrupted grooving
press-fit holes

buried holes
blind holes - aspect Ratio 1:1

flexible printed circuit boards - material on stock

teflon, ceramic - materials on request

PCB Base Material - options

– RF, Microwave, High Speed Digital PCBs

RF and microwave PCBs are typically built using advanced composites with specific characteristics for dielectric constant Dk, loss tangent Df, and coefficient of thermal expansion (CTE).

High frequency circuit materials with a low stable Dk and loss tangent Df allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same stack-up for optimal performance and economics.

Our supplier choice for a RF and Microwave PCBs material is isola – a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer printed circuit boards. Isola high-performance materials are used in a diverse range of electronic end-markets including applications in computers, networking and communications equipment, high-end consumer electronics, as well as products designed for use in the advanced automotive, aerospace, military and medical markets.
The company invests in research and development to create industry-leading products formulated to meet the most demanding performance requirements of its customers, the printed circuit board fabricators, and the designers and original equipment manufacturers (OEMs) they serve. The global footprint includes manufacturing facilities and research centers located in Europe and the United States.

Competitive matrix

(for materials we have available in stock)
Isola Product Dk @ 10GHz Df @ 10GHz
I-Tera® MT40 RF 3.38 0.0028
I-Tera® MT40 MW 3.45 0.0030
Competitive material Dk @ 10GHz Df @ 10GHz
Rogers RO4003 3.38 0.0027
Taconic TLC-338 3.38 0.0034
Rogers (Arlon 25N) 3.38 0.0025
Nelco NH9338 3.38 0.0025
Nelco N9530-13RF 3.38 0.0046
Rogers RO4534 3.40 0.0027
Nelco Meteorwave 1000 3.40 0.0040
Rogers RO4350B 3.48 0.0037
Rogers RO4350BTX 3.48 0.0034
Rogers RO4835 3.48 0.0037
Nelco NH9348 3.48 0.0037
Nelco NH9350-13RF 3.48 0.0055

RF, Microwave material available on stock:

Thickness [mm] Dk (2-20 GHz) Df (2-20 GHz) Tg (℃) CTE in Z-Axis (ppm/℃) Cu type VLP-2 Cu thick. (μm) Panel size [mm]

I-Tera MT40 RF

Laminate 0.127 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 0.254 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 0.508 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 0.762 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 1.016 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 1.524 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505

I-Tera MT40 MW

Laminate 0.254 3.45 0.0030 200 290 Rz=2 μm 18/18 275x505
Laminate 0.508 3.45 0.0030 200 290 Rz=2 μm 18/18 275x505


PR2116 0.138 3.48 0.0031 200 290 59% resin content 275x505
PR1080 0.101 3.14 0.0022 200 290 73% resin content 275x505
PR1035 0.064 3.14 0.0022 200 290 73% resin content 275x505

RF PCB Layer Stackup – “Pure Build” Versus “Hybrid Build”

A “Pure build” refers to a multilayer PCB material construction that is composed of the same type of material throughout the stackup.
A „Hybrid build“ could use a mix of Isola PCL370HR high performance material 180°Tg with high-frequency material Isola I-Tera MT40.

The reasons for using a hybrid construction in RF multilayer PCB designs are typically driven by cost, reliability, or electrical performance.

When designs feature a number of noncritical circuit layers, these can usually be built on the more cost-friendly PCL370HR material only using high-frequency RF materials on the critical circuit layers.

Hybrid construction is becoming more popular as technology evolves, but hybrids bring both benefits and challenges that need to be understood. Working closely with the PCB fabricator will ensure the best construction methodology that balances RF performance and PCB manufacturability.

SQP International Towards 5G – Shaping our Europe’s digital future

The “fifth generation” of telecommunication systems, or 5G, will be one of the most critical building blocks of our digital economy and society in the next decade. SQP International has taken significant steps to participate in global developments towards this strategic technology.

High speed digital printed circuit boards are key components for devices processing or transmitting high data rates. Typical applications are IC test systems, 5G base stations, internet switches, IoT devices and high speed computing. These systems operate in many cases with data rates of 10Gbit/s or more.

Infographic over de voordelen van 5G

Please select suitable material based on its specs and features – detailed material specification.

Maximum panel dimensions

Double sided PCB Multilayer PCB
325 mm x 582 mm 274 mm x 505 mm

ML copper-clad laminates on stock

(laminate thickness)
Isola DE104 Isola PCL370HR
[mm] Cu 18/18 Cu 35/35 Cu 70/70 Cu 18/18 Cu 35/35 Cu 70/70 Cu 105/105

Rigid copper-clad laminates on stock

(overall thickness)
Isola DE104 Isola PCL370HR
[mm] Cu 0/35 Cu 18/18 Cu 35/35 Cu 50/50 Cu 70/70 Cu 18/18 Cu 35/35 Cu 50/50 Cu 70/70

Prepregs on stock

Isola DE104 Isola PCL370HR
Type Pressed thickness [mm]
106 0.057 0.045
1080 - 0.065
2116 0.105 0.090
7628 0.197 0.172
PL05 2116 - 0.110
PL04 7628 - 0.198
PL05 1080 - 0.070

Copper foils on stock

Thickness [um] Copper Foil
106 48 µm 46 µm 48 µm
1080 69 µm
2116 109 µm 97 µm 99 µm
106 48 µm 46 µm 48 µm

Copper foils on stock

Copper foil
Thickness [µm] 312 x 380 mm 312 x 512 mm 312 x 600 mm

Standard multilayer build-ups:

standaard multilayer build twee laags
standaard multilayer build drie laags
Standaard multilayer build vier laags

Multilayer PCB build-up is possible according to customer requirements.

Controlled impedance PCBs

Software for impedance calculation and test coupon design:
ICD Stackup Planner from In-Circuit Design Pty Ltd. (

Controlled impedance measuring device:
Zmetrix ST300 from ZMetrix, Inc. (

Measurement according IPC-2141A (

Example of impedance calculation and test coupon design

voorbeeld van impedance berekening en test coupon ontwerp
banner in circuit design pty ltd. board level sumulation specialists

Zmetrix controlled impedance workstation

Zmetrix controlled impedance workstation

Controlled impedance measurement

controlled impedance measurement

Zmetrix controlled impedance software

Zmetrix controlled impedance software

Example of controlled impedance test protocol

impedance test report

PCB with the controlled impedance test coupon

PCB met de controlled impedance test coupon

Terminology and detailed material specifications

Tg – Glass Transition Temperature

Temperature point at which a glassy solid changes to an amorfous resin / epoxy

– if temperature exceeds Tg:
1. expansion of the material is growing rapidly in the direction of Z axis
2. mechanical material properties degrade rapidly (strength, bonds in the material)

Td – Decomposition Temperature

Temperature at which there is a 5% weight loss of resin / epoxy

– if temperature exceeds Td:
1. irreversible destruction in material occurs due to breach of chemical bonds in resin / epoxy


Measures time to delamination at specific temperature (i.e. 260°C/288°C)

CTE – Coefficient of Thermal Expansion

Dimensional increasing of the material in the X-, Y-and Z-axis by change of temperature at a constant pressure

CAF – Conductive Anodic Filament

Migration of copper ions through an enclosed moisture in the material, which can over time cause a short circuit

Isola DE 104 Isola IS410 Isola 370HR
IPC-4101C Spec 21 21/24/26/28/121/124 21/24/26/98/99/101/126
Tg Glass Transition Temperature by DSC, spec minimum [°C] 130 175 175
Td Decomposition Temperature @ 5% wt loss [°C] 330 350 340
T260 Mins 60 50 60
T288 Mins >5 >10 30
CTE, Z-axis Pre Tg 50 65 45
% Z-Axis Expansion (50-260C) 3 3.5 2.8
CTE, Z-axis Post Tg 250 250 230
CTE, Pre X, Y 13 13/14 13/14
CTE, Post Tg X, Y 14 15/17 14/17
Thermal Conductivity 0.4 0.5 0.4
Thermal Stress 10 Sec @ 288°C (550.4°F), spec min pass pass pass
Permittivity (Dk) 100 MHz HP4285A 4 3.96 4.24
Permittivity (Dk) 1 GHz HP4291A 4 3.9 4.17
Permittivity (Dk) 2 GHz Bereskin Stripline 4 3.97 4.04
Permittivity (Dk) 5 GHz Bereskin Stripline 4 3.87 3.92
Permittivity (Dk) 10 GHz Bereskin Stripline 3.59 3.87 3.92
Loss Tangent (Df) 100 MHz HP4285A 0.02 0.0149 0.015
Loss Tangent (Df) 1 GHz HP4291A 0.02 0.0189 0.0161
Loss Tangent (Df) 2 GHz Bereskin Stripline 0.022 0.02 0.021
Loss Tangent (Df) 5 GHz Bereskin Stripline 0.02 0.023 0.025
Loss Tangent (Df) 10 GHz Bereskin Stripline 0.02 0.023 0.025
Volume Resistivity (After moisture resistance) 1.3x10^8 5.0x10^8 3.0x10^10
Volume Resistivity (At elevated temperature) 3.4 x10^3 3.6 x10^5 7.0 x10^8
Surface Resistivity (After moisture resistance) 1.0x10^8 8.0x10^5 3.0x10^8
Surface Resistivity (At elevated temperature) 7.0x10^8 4.5x10^8 2.0x10^8
Dielectric Breakdown, spec minimum >50 >50 >50
Arc Resistance, spec minimum 120 129 115
Electric Strength, spec minimum (Laminate & prepreg as laminated) 54 (1350) 44 (1100) 54 (1350)
Comparative Tracking Index (CTI) 2 [250 - 399] 3 [175 - 249] 3 [175 - 249]
Peel Strength Low profile Cu foil, very low profile – all Cu >17um 6.5(1.14) 7 (1.23) 6 (1.05)
Peel Strength Standard profile copper - After thermal stress 7 (1.23) 7 (1.23) 9 (1.58)
Peel Strength Standard profile copper - At 125°C (257°F) 6.5(1.14) 6.5(1.14) 7 (1.23)
Peel Strength Standard profile copper - After process solutions 7 (1.23) 7 (1.23) 9 (1.58)
Flexural Strength Lengthwise direction 89.00 79.00 90.00
Flexural Strength Crosswise direction 70.00 68.00 77.00
Moisture Absorption, spec maximum 0.3 0.2 0.15
Flammability (Laminate & prepreg as laminated), spec min V0 V0 V0
Max Operating Temperature (MOT) [°C] 130 130 (150) 130 (150)
DSR yes yes yes
Termologie en gedetailleerde materiaal specificaties.

Milestones pcb production


SQP: Founder of Dutch company Klingelnberg-Klauss Electronics B.V., Mr.Jeroen Charmant, established a PCB service centre in the Slovak Republic. New company‘s designated CEO is Mr.Peter Hric. CAD/CAM service, Film plotting with Laser raster photo plotter and Electrical test fixture preparations are provided for various local PCB manufacturers as highly advanced technologies. World state: Over 900 PCB manufacturers are within Europe. China is not a player in PCB business yet. In this time the Internet was non-existent.


SQP: Multilayer Printed Circuit Board Production is initiated.


SQP: Multilayer production, ENIG surface and flying probe electrical testing becomes the standard. Online resources planning and communication system (ERP) is programmed and applied. World state: At this stage the dot-com bubble just crashed, only 350 PCB manufacturers remain in Europe. China is importing PCBs into Europe and gradually climbs the market.


SQP: Company premises are completed in construction housing a team of 30 driven experienced employees. Company is debt free and running healthily despite world crisis.


SQP: New technologies are utilized: UCAM Software for data processing Optical in-layer registration in drilling process Automatic Optical Inspection Controlled Impedance…


SQP: Laser Direct Imaging from Orbotech is introduced and accordingly SQP starts to produce PCBs with 100 micrometer technology. As well, company starts Filled / Over plated / Holes – technology. World state: Globalisation is at its peak, China is dominantly ruling PCB world with over 1480 manufacturers. Number of PCB manufacturers deteriorated to only 170 PCB in Europe.


SQP: ISO 9001:2015, ISO 14001:2015 certification are acquired. World state: Globalisation is breaking down, disrupted supply chain, Conflict with Russia, risk of Chinese invassion of Taiwan, CCP policy and global economic recession. Global PCB suppliers have a well established position in European market. Europe needs to backtrack its own strategic manufacturing capabilities in order to become more selfsufficient.


It is a part of our narrative to follow the vision of a greater European PCB self sufficiency.

PCB - Speed of delivery

The parcel with PCBs will be delivered within 48 hours (2 working days) from receipt of order and data.
In “48hour Service” we supply PCB in standard configuration and low volume.

Day 1: Order and Data receipt before 9.30 >>> Day 2: PCB dispatch by courier >>> Day 3: Delivery of PCB

In “Superexpress mode” PCBs will be manufactured in 3 working days.

Day 1: Order and Data receipt before 9.30 >>> Day 3: PCB dispatch by courier >>> Day 4: Delivery of PCB

In “Express mode” PCBs will be manufactured in 4 working days.

Day 1: Order and Data receipt before 9.30 >>> Day 4: PCB dispatch by courier >>> Day 5: Delivery of PCB

In “Standard mode” PCBs will be manufactured in 5 working days.

Day 1: Order and Data receipt before 12.00 >>> Day 5: PCB dispatch by courier >>> Day 6: Delivery of PCB

PCB delivery
For comfortable and fast delivery of PCBs, we primarily use the DHL delivery service.
In accordance with the DHL delivery conditions the parcel will be delivered on the next working day after dispatch.