PCB Base Material – options

– RF, Microwave, High Speed Digital PCBs

RF and microwave PCBs are typically built using advanced composites with specific characteristics for dielectric constant Dk, loss tangent Df, and coefficient of thermal expansion (CTE).

High frequency circuit materials with a low stable Dk and loss tangent Df allow for high speed signals to travel through the PCB with less impedance than standard FR-4 PCB materials. These materials can be mixed in the same stack-up for optimal performance and economics.

Our supplier choice for a RF and Microwave PCBs material is isola – a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer printed circuit boards. Isola high-performance materials are used in a diverse range of electronic end-markets including applications in computers, networking and communications equipment, high-end consumer electronics, as well as products designed for use in the advanced automotive, aerospace, military and medical markets.
The company invests in research and development to create industry-leading products formulated to meet the most demanding performance requirements of its customers, the printed circuit board fabricators, and the designers and original equipment manufacturers (OEMs) they serve. The global footprint includes manufacturing facilities and research centers located in Europe and the United States.

Competitive matrix

(for materials we have available in stock)
Isola Product Dk @ 10GHz Df @ 10GHz
I-Tera® MT40 RF 3.38 0.0028
I-Tera® MT40 MW 3.45 0.0030
Competitive material Dk @ 10GHz Df @ 10GHz
Rogers RO4003 3.38 0.0027
Taconic TLC-338 3.38 0.0034
Rogers (Arlon 25N) 3.38 0.0025
Nelco NH9338 3.38 0.0025
Nelco N9530-13RF 3.38 0.0046
Rogers RO4534 3.40 0.0027
Nelco Meteorwave 1000 3.40 0.0040
Rogers RO4350B 3.48 0.0037
Rogers RO4350BTX 3.48 0.0034
Rogers RO4835 3.48 0.0037
Nelco NH9348 3.48 0.0037
Nelco NH9350-13RF 3.48 0.0055

RF, Microwave material available on stock:

Thickness [mm] Dk (2-20 GHz) Df (2-20 GHz) Tg (℃) CTE in Z-Axis (ppm/℃) Cu type VLP-2 Cu thick. (μm) Panel size [mm]

I-Tera MT40 RF

Laminate 0.127 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 0.254 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 0.508 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 0.762 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 1.016 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505
Laminate 1.524 3.38 0.0028 200 290 Rz=2 μm 18/18 275x505

I-Tera MT40 MW

Laminate 0.254 3.45 0.0030 200 290 Rz=2 μm 18/18 275x505
Laminate 0.508 3.45 0.0030 200 290 Rz=2 μm 18/18 275x505

Prepreg

PR2116 0.138 3.48 0.0031 200 290 59% resin content 275x505
PR1080 0.101 3.14 0.0022 200 290 73% resin content 275x505
PR1035 0.064 3.14 0.0022 200 290 73% resin content 275x505

RF PCB Layer Stackup – “Pure Build” Versus “Hybrid Build”

A “Pure build” refers to a multilayer PCB material construction that is composed of the same type of material throughout the stackup.
A „Hybrid build“ could use a mix of Isola PCL370HR high performance material 180°Tg with high-frequency material Isola I-Tera MT40.

The reasons for using a hybrid construction in RF multilayer PCB designs are typically driven by cost, reliability, or electrical performance.

When designs feature a number of noncritical circuit layers, these can usually be built on the more cost-friendly PCL370HR material only using high-frequency RF materials on the critical circuit layers.

Hybrid construction is becoming more popular as technology evolves, but hybrids bring both benefits and challenges that need to be understood. Working closely with the PCB fabricator will ensure the best construction methodology that balances RF performance and PCB manufacturability.

SQP International Towards 5G – Shaping our Europe’s digital future

The “fifth generation” of telecommunication systems, or 5G, will be one of the most critical building blocks of our digital economy and society in the next decade. SQP International has taken significant steps to participate in global developments towards this strategic technology.

High speed digital printed circuit boards are key components for devices processing or transmitting high data rates. Typical applications are IC test systems, 5G base stations, internet switches, IoT devices and high speed computing. These systems operate in many cases with data rates of 10Gbit/s or more.

Infographic over de voordelen van 5G

Please select suitable material based on its specs and features – detailed material specification.

Maximum panel dimensions

Double sided PCB Multilayer PCB
325 mm x 582 mm 274 mm x 505 mm

ML copper-clad laminates on stock

Thickness
(laminate thickness)
Isola DE104 Isola PCL370HR
[mm] Cu 18/18 Cu 35/35 Cu 70/70 Cu 18/18 Cu 35/35 Cu 70/70 Cu 105/105
0.075
0.100
0.125
0.150
0.200
0.300
0.360
0.410
0.460
0.560
0.610
0.710
0.900
1.000

Rigid copper-clad laminates on stock

Thickness
(overall thickness)
Isola DE104 Isola PCL370HR
[mm] Cu 0/35 Cu 18/18 Cu 35/35 Cu 50/50 Cu 70/70 Cu 18/18 Cu 35/35 Cu 50/50 Cu 70/70
1.00
1.20
1.50
2.00
2.40
3.20

Prepregs on stock

Isola DE104 Isola PCL370HR
Type Pressed thickness [mm]
106 0.057 0.045
1080 - 0.065
2116 0.105 0.090
7628 0.197 0.172
PL05 2116 - 0.110
PL04 7628 - 0.198
PL05 1080 - 0.070

Copper foils on stock

Thickness [um] Copper Foil
5
6
12
18
35
50
70
105
140
106 48 µm 46 µm 48 µm
1080 69 µm
2116 109 µm 97 µm 99 µm
106 48 µm 46 µm 48 µm

Copper foils on stock

Copper foil
Thickness [µm] 312 x 380 mm 312 x 512 mm 312 x 600 mm
5
9
12
18
35
50
70
105
140

Standard multilayer build-ups:

standaard multilayer build twee laags
standaard multilayer build drie laags
Standaard multilayer build vier laags

Multilayer PCB build-up is possible according to customer requirements.