Tg – Glass Transition Temperature
Temperature point at which a glassy solid changes to an amorfous resin / epoxy
– if temperature exceeds Tg:
1. expansion of the material is growing rapidly in the direction of Z axis
2. mechanical material properties degrade rapidly (strength, bonds in the material)
Td – Decomposition Temperature
Temperature at which there is a 5% weight loss of resin / epoxy
– if temperature exceeds Td:
1. irreversible destruction in material occurs due to breach of chemical bonds in resin / epoxy
T260/T288
Measures time to delamination at specific temperature (i.e. 260°C/288°C)
CTE – Coefficient of Thermal Expansion
Dimensional increasing of the material in the X-, Y-and Z-axis by change of temperature at a constant pressure
CAF – Conductive Anodic Filament
Migration of copper ions through an enclosed moisture in the material, which can over time cause a short circuit
| Isola DE 104 | Isola IS410 | Isola 370HR | |
|---|---|---|---|
| IPC-4101C Spec | 21 | 21/24/26/28/121/124 | 21/24/26/98/99/101/126 |
| Tg Glass Transition Temperature by DSC, spec minimum [°C] | 130 | 175 | 175 |
| Td Decomposition Temperature @ 5% wt loss [°C] | 330 | 350 | 340 |
| T260 Mins | 60 | 50 | 60 |
| T288 Mins | >5 | >10 | 30 |
| CTE, Z-axis Pre Tg | 50 | 65 | 45 |
| % Z-Axis Expansion (50-260C) | 3 | 3.5 | 2.8 |
| CTE, Z-axis Post Tg | 250 | 250 | 230 |
| CTE, Pre X, Y | 13 | 13/14 | 13/14 |
| CTE, Post Tg X, Y | 14 | 15/17 | 14/17 |
| Thermal Conductivity | 0.4 | 0.5 | 0.4 |
| Thermal Stress 10 Sec @ 288°C (550.4°F), spec min | pass | pass | pass |
| Permittivity (Dk) 100 MHz HP4285A | 4 | 3.96 | 4.24 |
| Permittivity (Dk) 1 GHz HP4291A | 4 | 3.9 | 4.17 |
| Permittivity (Dk) 2 GHz Bereskin Stripline | 4 | 3.97 | 4.04 |
| Permittivity (Dk) 5 GHz Bereskin Stripline | 4 | 3.87 | 3.92 |
| Permittivity (Dk) 10 GHz Bereskin Stripline | 3.59 | 3.87 | 3.92 |
| Loss Tangent (Df) 100 MHz HP4285A | 0.02 | 0.0149 | 0.015 |
| Loss Tangent (Df) 1 GHz HP4291A | 0.02 | 0.0189 | 0.0161 |
| Loss Tangent (Df) 2 GHz Bereskin Stripline | 0.022 | 0.02 | 0.021 |
| Loss Tangent (Df) 5 GHz Bereskin Stripline | 0.02 | 0.023 | 0.025 |
| Loss Tangent (Df) 10 GHz Bereskin Stripline | 0.02 | 0.023 | 0.025 |
| Volume Resistivity (After moisture resistance) | 1.3x10^8 | 5.0x10^8 | 3.0x10^10 |
| Volume Resistivity (At elevated temperature) | 3.4 x10^3 | 3.6 x10^5 | 7.0 x10^8 |
| Surface Resistivity (After moisture resistance) | 1.0x10^8 | 8.0x10^5 | 3.0x10^8 |
| Surface Resistivity (At elevated temperature) | 7.0x10^8 | 4.5x10^8 | 2.0x10^8 |
| Dielectric Breakdown, spec minimum | >50 | >50 | >50 |
| Arc Resistance, spec minimum | 120 | 129 | 115 |
| Electric Strength, spec minimum (Laminate & prepreg as laminated) | 54 (1350) | 44 (1100) | 54 (1350) |
| Comparative Tracking Index (CTI) | 2 [250 - 399] | 3 [175 - 249] | 3 [175 - 249] |
| Peel Strength Low profile Cu foil, very low profile – all Cu >17um | 6.5(1.14) | 7 (1.23) | 6 (1.05) |
| Peel Strength Standard profile copper - After thermal stress | 7 (1.23) | 7 (1.23) | 9 (1.58) |
| Peel Strength Standard profile copper - At 125°C (257°F) | 6.5(1.14) | 6.5(1.14) | 7 (1.23) |
| Peel Strength Standard profile copper - After process solutions | 7 (1.23) | 7 (1.23) | 9 (1.58) |
| Flexural Strength Lengthwise direction | 89.00 | 79.00 | 90.00 |
| Flexural Strength Crosswise direction | 70.00 | 68.00 | 77.00 |
| Moisture Absorption, spec maximum | 0.3 | 0.2 | 0.15 |
| Flammability (Laminate & prepreg as laminated), spec min | V0 | V0 | V0 |
| HWI | 0 | ||
| Max Operating Temperature (MOT) [°C] | 130 | 130 (150) | 130 (150) |
| DSR | yes | yes | yes |
